Examples of our laser processing productsExamples

Shown in the chart below are some examples of laser processing products we produced based on over 30 years of our experience and expertise.
Please contact us if you would like to drill on any materials, even if not shown here.
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Category	Material	Usage
Ceramics	Alumina / Al2O3	Various Electronic Components
	Aluminum Nitride / AlN	High-Frequency Conponents
	Silicon Nitride / Si3N4	Probe Cards
	Machinable Ceramics	Probe Cards
	Sapphire / Al2O3
	Zirconia / ZrO2
	Sillicon Carbide / SiC	Power Devices
Silicon	Silicon
Glass	Glass
Thin Metal	Stainless Steel
	Copper
	Titanium	Filters
Resin	FR-4	Printed Wiring Boards
Resin	Polyimide	Vairous Electronic Components

Ceramics (Alumina / Al2O3)

Micro Holes Drilling

Φ40μm/0.2mmt

Ceramics (Alumina / Al2O3)

High Aspect Ratio Drilling

Aspect Ratio 10 [2.0mmt-Φ200μm]

Aspect Ratio 7.5 [0.635mmt-Φ85μm]

Ceramics (Alumina / Al2O3)

Scribing

Thickness of Material: 1.0mmt
Laser Spot Diameter: Φ0.15mm
Conical Hole Depth: 0.35mm
Pitch between Conical Holes: 0.14mm

Ceramics (Aluminum Nitride/AlN)

High Speed Drilling

0.635mmt Φ100μm 10,000 Holes

Ceramics (Silicon Nitride / Si3N4)

Micro Holes/ High Aspect Ratio Drilling

Aspect Ratio:10 [0.5mmt-Φ50μm]

Silicon (Nitride / Si3N4)

Various Shaped Hole

Narrowing Corner Radius of Rectangular Holes
Thickness of Material：250㎛
Hole Size：55㎛×55㎛
Pitch：90㎛ (Wall Thickness 35㎛)
Corner Radius≦5㎛
Square Hole Cross-sectional Shape
Thickness of Material：300㎛
Hole Size：50㎛×50㎛ (Aspect Ratio：6)
Pitch：80㎛

The probe card should have as large cross-sectional area of the pin as possible for high allowable current value.
For this purpose, the four corners of a square hole must be as sharp as possible to allow larger size pins to pass through.
We have succeeded in narrowing the corner radius of the four corners by introducing the latest laser and special optics.

Ceramics (Silicon Nitride / Si3N4)

High Aspect Ratio Drilling

Cross Section Image

Thickness：1.0 ㎜t
Hole Diameter：φ50㎛ (Aspect Ratio：20)
Pitch：100㎛ (Least Wall Thickness 50㎛)

It is unfortunately inevitable that laser processing will have a smaller processing diameter on the laser exit side than one on the laser entrance side (taper), and high aspect ratio processing (material thickness to hole diameter) by lasering is hard to achieve.
We have achieved aspect ratio of 20 by combining specialized optical systems.
To the customers who had been using layers of thinner plates than required, we can provide high strength, high precision, and low cost solution by processing a single plate of right thickness.

Ceramics (Silicon Nitride / Si3N4)

Narrow Pitch Processing

Square Hole
Thickness of material：380㎛t
Hole Size：42㎛×42㎛
Pitch：50㎛ (Wall thickness 8㎛)

To increase the number of pins on the probe card, the pitch must be as close as possible.
Closing the pitch makes the walls between adjacent holes thinner and more prone to collapse after processing.
By using special optics, we have minimized the taper (difference between the hole diameter of the laser entry side and that of the opposite side) that is inherent in laser processing, and have achieved straight micro drilling with virtually no taper. It thereby allows the wall thickness between holes to be minimized.

Ceramics (Silicon Nitride / Si3N4)

Counterbore

Top
Bottom

Plate Thickness：3.0mmt
Depth of counterbore：2.75mm (Remaining part thickness 0.25mm)
Angle to Vertical wall ≒86°
Flatness ≦10㎛
Ra≦4㎛

The two most difficult parts are to make the wall surface as vertical as possible (to ensure as wide a flat area on the bottom as possible) and to make the bottom as flat as possible.
Hard SiN substrates used to take a long time to machine, but we have achieved the same quality and overwhelmingly short lead time with laser processing as with machine processing.

Machinable Ceramics

Micro Hole/High Aspect Ratio Drilling